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Huizhou Liandajin Electronic Co., Ltd
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Blind Buried via plate

HDI circuit board is a circuit board with high circuit distribution density using micro-blind and buried via technology.The HDI board is divided into inner layer circuit and outer layer circuit, and the internal connection of each layer circuit is realized by drilling and metallization. Therefore, the higher the application of HDI technology, the higher the manufacturing level of the laminate. Ordinary HDI boards are laminated once, and high-end HDI uses two, three or more lamination processes, as well as electroplating fill holes, stack holes, laser direct drilling, etc. We are a large professional printed circuit board manufacturer and also have the ability to produce multi-layer HDI circuit boards.

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Certificate
ZPMV2.E344687
ENIG REACH Test Report
No.CKGEC2000877703
OSP REACH Test Report
HASL LF RoHs test report
ISO13485
ISO9001
ISO14001
ISO45001
IATF16949
CQC
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